MPi Advanced Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Screen driver, logic, and memory machine. MPI’s cantilever probes tend to be the corresponding answer on the requires of fi­ne pitch, tiny pad dimensions, substantial velocity, considerably less cleansing, multi-DUT, superior pin rely, and extremely-very low leakage requirements. With superb craftsmanship, modern architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever company all over the world.


FCB Probe Card

The FCB Probe Card is easily the most mature know-how of buckling beam probe card. It is actually aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is really a confirmed solution for various semiconductor generation checks from early engineering pilot-runs to substantial volume manufacturing (HVM). FCB is ready for unit necessitating substantial signal integrity probing (SI) and/or electric power integrity probing (PI). Apps incorporate cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the whole world’s greatest General Price-of-possession (COO) for various DUT programs.


EVS Probe Card

The EVS Probe Card is really an improvement around the traditional buckling beam probe card. Key characteristics are greater current carrying capacity (C.C.C.) and decrease well balanced Get in touch with pressure (BCF), in addition to Over-all MEMS-like attributes. EVS can easily satisfy the prerequisite of advanced wafer probing. read more Exact alignment and superb planarity Command are definitely the key components contributing to stable Make contact with resistance. With its capacity and general performance, EVS Probe Card is a really perfect option for State-of-the-art probe cards.


Osprey probe card

The Osprey probe card is MPI’s solution to demand for at any time finer pitch. It is made for more compact Al pad, and is also ideal for very small pitch software with peripheral and comprehensive array sample. With specific alignment and greater planarity Manage, Osprey can achieve higher efficiency by multi-DUT structure.  The forming wire (FW) form needle generated with MPI’s individual micro fabrication system not only delivers large-good quality performance but will also permits effortless needle replacement and shortens retaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's designed for the demand from customers of lower force probing. In addition it includes a chance to satisfy significant C.C.C. and large pin counts software. The MEMS method ensures very dependable needle characteristics, and the Exclusive construction style permits precise alignment and planarity Command.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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